Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DO-214AB
External dimensions/width: 6.22 mm
External dimensions/packaging: DO-214AB
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ES3G
|
SEP | 功能相似 | SMC-2 |
MULTICOMP ES3G 快速/超快二极管, 单, 400 V, 3 A, 1.3 V, 35 ns, 100 A
|
||
ES3G
|
Taiwan Semiconductor | 功能相似 | DO-214AB-2 |
MULTICOMP ES3G 快速/超快二极管, 单, 400 V, 3 A, 1.3 V, 35 ns, 100 A
|
||
ES3G
|
Diotec Semiconductor | 功能相似 | DO-214AB |
MULTICOMP ES3G 快速/超快二极管, 单, 400 V, 3 A, 1.3 V, 35 ns, 100 A
|
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