Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34ML04G200BHI000
|
Cypress Semiconductor | 完全替代 | BGA-63 |
芯片, 闪存 存储器, 2048 MB, 25 NS, 63-BGA
|
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