Technical parameters/power supply current: 30 mA
Technical parameters/digits: 8
Technical parameters/access time (Max): 20 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 3.3 V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSOP-48
External dimensions/packaging: TSOP-48
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.b.1.a
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34ML04G100BHI003
|
Spansion | 类似代替 | BGA |
SLC NAND Flash Parallel 3V/3.3V 4G-bit 512M x 8 20ns 63Pin BGA T/R
|
||
S34ML04G100BHI003
|
Cypress Semiconductor | 类似代替 | BGA |
SLC NAND Flash Parallel 3V/3.3V 4G-bit 512M x 8 20ns 63Pin BGA T/R
|
||
S34ML04G100TFI000
|
Spansion | 完全替代 | TSOP-48 |
S34ML04G1 系列 4 Gb (512M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - TSOP-48
|
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