Technical parameters/number of pins: 2
Technical parameters/forward voltage: 1.25V @150mA
Technical parameters/thermal resistance: 500℃/W (RθJA)
Technical parameters/reverse recovery time: 4 ns
Technical parameters/forward current: 250 mA
Technical parameters/Maximum forward surge current (Ifsm): 4 A
Technical parameters/forward voltage (Max): 1.25 V
Technical parameters/forward current (Max): 250 mA
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature: 150℃ (Max)
Technical parameters/dissipated power (Max): 400 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/packaging: SOD-323
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Consumer Electronics, Industrial, automotive, portable devices, power management, power management, portable devices, industrial, automotive, consumer electronics products
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAS316,115
|
NXP | 类似代替 | SOD-323 |
BAS316,115 编带
|
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