Technical parameters/digits: 16
Technical parameters/access time (Max): 110 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: FBGA-64
External dimensions/packaging: FBGA-64
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL256S11DHIV10
|
Spansion | 完全替代 | FBGA-64 |
NOR Flash Parallel 3V/3.3V 256Mbit 16M x 16Bit 110ns 64Pin FBGA Tray
|
||
S29GL256S11DHIV10
|
Cypress Semiconductor | 完全替代 | BGA |
NOR Flash Parallel 3V/3.3V 256Mbit 16M x 16Bit 110ns 64Pin FBGA Tray
|
||
S29GL256S11FHIV10
|
Cypress Semiconductor | 完全替代 | BGA-64 |
NOR闪存 Nor
|
||
|
|
Spansion | 完全替代 | LBGA |
NOR闪存 Nor
|
||
|
|
Spansion | 完全替代 | LBGA |
NOR Flash Parallel 3V/3.3V 256Mbit 16M x 16Bit 110ns 64Pin FBGA Tray
|
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