Technical parameters/digits: 8, 16
Technical parameters/access time (Max): 90 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSOP-56
External dimensions/packaging: TSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128P90TFIR13
|
Spansion | 完全替代 | TSOP |
NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8Bit/16Bit 90ns 56Pin TSOP T/R
|
||
|
|
Cypress Semiconductor | 完全替代 | TSOP |
NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8Bit/16Bit 90ns 56Pin TSOP T/R
|
||
S29GL128P90TFIR20
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
GL-P 系列 128 M (16 M x 8) 3.6 V 90 ns 表面贴装 闪存 - TSOP-56
|
||
S29GL128P90TFIR20
|
Spansion | 完全替代 | TSOP-56 |
GL-P 系列 128 M (16 M x 8) 3.6 V 90 ns 表面贴装 闪存 - TSOP-56
|
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