Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 完全替代 |
GL-N 系列 32 M (4 M x 8/2 M x 16) 3.6 V 页面模式 闪存 - TSOP-8
|
|||
S29JL032H90TAI310
|
Spansion | 完全替代 | TSOP-48 |
NOR闪存 3V 32Mb Float Gate top boot 2Banks 90s
|
||
S29JL032H90TAI310
|
Cypress Semiconductor | 完全替代 | TSOP-48 |
NOR闪存 3V 32Mb Float Gate top boot 2Banks 90s
|
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