Encapsulation parameters/Encapsulation: TSOP-56
External dimensions/packaging: TSOP-56
Other/Series: GL-S
Other/Packaging: Tray Alternate Packaging
Other/Matching Style: SMD/SMT
Other/Package Case: TSOP-56
Other operating temperatures: -40°C ~ 85°C (TA)
Other/Interface: Parallel
Other/Voltage Supply: 2.7 V ~ 3.6 V
Other/Supplier Device Packages: 56-TSOP
Other/Memory Size: 128M (8M x 16)
Other/Memory Type: FLASH - NOR
Other/Speed: 90ns
Other/Architecture: MirrorBit Eclipse
Other/Format Memory: FLASH
Other/Standard: Common Flash Interface (CFI)
Other/Interface Type: Parallel
Other/Organization: 16 M x 8
Other/Supply Current Max: 100 mA
Other/Data Bus Wideth: 8 bit
Other/Supply Voltage Max: 3.6 V
Other/Supply Voltage Min: 2.7 V
Other/Ting Type: Asynchronous
Compliant with standards/RoHS standards: RoHS Compliant
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