Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128S10TFIV10
|
Spansion | 完全替代 | TFSOP-56 |
NOR闪存 S29GL128S10TFIV10 TSOP-56
|
||
S29GL128S10TFIV20
|
Spansion | 完全替代 | TSOP-56 |
GL-P 系列 128 M (8 M x 16) 3.6 V 100 ns 表面贴装 闪存 - TSOP-56
|
||
S29GL128S10TFIV23
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
闪存, 并行NOR, 128 Mbit, 16M x 8位, CFI, 并行, TSOP, 56 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review