Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/length: 13 mm
External dimensions/width: 11 mm
External dimensions/packaging: LBGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128S10DHI010
|
Spansion | 完全替代 | FBGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 100ns 64Pin FBGA Tray
|
||
S29GL128S10DHI010
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 100ns 64Pin FBGA Tray
|
||
S29GL128S10DHIV10
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
NOR闪存 S29GL128S10DHIV10 FBGA-64
|
||
S29GL128S10DHIV10
|
Spansion | 完全替代 | FBGA-64 |
NOR闪存 S29GL128S10DHIV10 FBGA-64
|
||
S29GL128S10DHIV20
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
NOR Flash Parallel 3V/3.3V 128Mbit 8M x 16Bit 100ns 64Pin FBGA Tray
|
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