Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Spansion | 功能相似 | HTSSOP |
NOR闪存 Nor
|
||
S29GL128P11TFI023
|
Spansion | 功能相似 | HTSSOP |
Ic Flash 128Mbit 110ns 56tsop
|
||
S29GL128P11TFI023
|
Cypress Semiconductor | 功能相似 | TSOP-56 |
Ic Flash 128Mbit 110ns 56tsop
|
||
|
|
Spansion | 功能相似 | HTSSOP |
闪存, 并行NOR, 128 Mbit, 16M x 8位, CFI, 并行, TSOP, 56 引脚
|
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