Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128P11TFIV10
|
Spansion | 完全替代 | TSOP-56 |
S29GL128P 系列 128 Mb (16M x 8) 2.7 ~ 3.6 V 110 ns 闪存-NOR 存储器 - TSOP-56
|
||
S29GL128P11TFIV13
|
Spansion | 完全替代 | HTSSOP |
NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8Bit/16Bit 110ns 56Pin TSOP T/R
|
||
S29GL128P11TFIV13
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8Bit/16Bit 110ns 56Pin TSOP T/R
|
||
|
|
Spansion | 完全替代 | HTSSOP |
闪存, 并行NOR, 128 Mbit, 16M x 8位, CFI, 并行, TSOP, 56 引脚
|
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