Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL128P10TAI010
|
Cypress Semiconductor | 类似代替 | TSOP-56 |
NOR Flash Parallel 3V/3.3V 128M-bit 16M x 8/8M x 16 100ns 56Pin TSOP Tray
|
||
|
|
AMD | 完全替代 |
S29GL128P 系列 128 Mb (16M x 8) 3 V 100 ns 表面贴装 闪存-NOR 存储器 - TSOP-56
|
|||
S29GL128P10TFI020
|
Spansion | 完全替代 | TSOP |
S29GL128P 系列 128 Mb (16M x 8) 3 V 100 ns 表面贴装 闪存-NOR 存储器 - TSOP-56
|
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