Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W29GL128CL9B
|
Winbond Electronics | 功能相似 | LBGA-64 |
NOR Flash Parallel 3V/3.3V 128M-bit 128M x 1 100ns 48Pin LFBGA
|
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