Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/power supply current: 60 mA
Technical parameters/number of pins: 64
Technical parameters/access time: 100 ns
Technical parameters/memory capacity: 128000000 B
Technical parameters/access time (Max): 100 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: FBGA-64
External dimensions/packaging: FBGA-64
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Each
Other/Manufacturing Applications: Computers & Computer Peripherals, Communication and Networking, Consumer Electronics, Industrial, Computers and Computer Peripherals, Communications&Networking
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS10DHI010
|
Spansion | 完全替代 | FBGA |
闪存, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS10DHI010
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
闪存, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS10DHI020
|
Spansion | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHI010
|
Spansion | 功能相似 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHI010
|
Cypress Semiconductor | 功能相似 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
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