Encapsulation parameters/Encapsulation: TBGA
External dimensions/packaging: TBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHV313
|
Spansion | 功能相似 | TBGA |
Flash Memory Nor
|
||
S25FL512SAGBHVB13
|
Spansion | 功能相似 | TBGA |
Tape And Reel / 512Mbit Cmos 3V 65nm Flash Memory With 133MHz Spi (Serial Peripheral Interface) And Multi i/o...
|
||
S25FL512SAGBHVB13
|
Cypress Semiconductor | 功能相似 | BGA |
Tape And Reel / 512Mbit Cmos 3V 65nm Flash Memory With 133MHz Spi (Serial Peripheral Interface) And Multi i/o...
|
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