Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS10DHI023
|
Spansion | 完全替代 | LBGA |
NOR Flash Parallel 3V/3.3V 1G-bit 64M x 16 100ns 64Pin FBGA T/R
|
||
|
|
Cypress Semiconductor | 完全替代 | BGA |
NOR Flash Parallel 3V/3.3V 1G-bit 64M x 16 100ns 64Pin FBGA T/R
|
||
S29GL01GS11DHIV10
|
Cypress Semiconductor | 功能相似 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHIV13
|
Cypress Semiconductor | 功能相似 | BGA |
NOR Flash Parallel 3V/3.3V 1G-bit 64M x 16 110ns 64Pin Fortified BGA T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review