Technical parameters/access time (Max): 14.5 ns
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/length: 8 mm
External dimensions/width: 6 mm
External dimensions/packaging: BGA-24
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHIA10
|
Cypress Semiconductor | 功能相似 | BGA-24 |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, FBGA, 24 引脚
|
||
S25FL512SAGBHIA10
|
Spansion | 功能相似 | TBGA |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, FBGA, 24 引脚
|
||
S25FL512SAGBHIC10
|
Cypress Semiconductor | 功能相似 | BGA-24 |
FL-S 系列 512 M (64 M x 8) 3.6 V MirrorBit® 闪存 非易失性 存储器 - BGA-24
|
||
S25FL512SAGBHIC10
|
Spansion | 功能相似 | BGA-24 |
FL-S 系列 512 M (64 M x 8) 3.6 V MirrorBit® 闪存 非易失性 存储器 - BGA-24
|
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