Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHIA10
|
Cypress Semiconductor | 功能相似 | BGA-24 |
IC FLASH 512Mbit CMOS SPI 24BGA
|
||
S25FL512SAGBHIA10
|
Spansion | 功能相似 | TBGA |
IC FLASH 512Mbit CMOS SPI 24BGA
|
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