Encapsulation parameters/Encapsulation: TBGA
External dimensions/packaging: TBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064P0XMFI001
|
Spansion | 功能相似 | SOIC-16 |
SPANSION S25FL064P0XMFI001 闪存, 或非, 64 Mbit, 104 MHz, SPI, SOIC, 16 引脚
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