Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064P0XMFI001
|
Spansion | 功能相似 | SOIC-16 |
SPANSION S25FL064P0XMFI001 闪存, 或非, 64 Mbit, 104 MHz, SPI, SOIC, 16 引脚
|
||
S25FL164K0XMFI011
|
Spansion | 功能相似 | SOIC-8 |
S25FL164K 系列 64 Mb (8M x 8) 3 V 108 MHz SPI 串行 闪存-NOR 存储器 - SOIC-8
|
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