Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL128P0XMFI001
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
SPANSION S25FL128P0XMFI001 芯片, 闪存, 128MB, 104MHZ, SOIC-16
|
||
S25FL128P0XMFI013
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
NOR Flash Serial-SPI 3V/3.3V 128Mbit 128M x 1Bit 8ns 16Pin SOIC W T/R
|
||
S25FL128P0XMFI013
|
Spansion | 功能相似 | SO-16 |
NOR Flash Serial-SPI 3V/3.3V 128Mbit 128M x 1Bit 8ns 16Pin SOIC W T/R
|
||
W25Q128BVFIG
|
Winbond Electronics | 功能相似 | SOP |
NOR Flash Serial-SPI 3V/3.3V 128M-bit 16M x 8 8.5ns 16Pin SOIC
|
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