Technical parameters/clock frequency: 104 MHz
Technical parameters/digits: 1
Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/height: 2.55 mm
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL128P0XMFI001
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
SPANSION S25FL128P0XMFI001 芯片, 闪存, 128MB, 104MHZ, SOIC-16
|
||
S25FL128P0XMFI003
|
Cypress Semiconductor | 完全替代 | SO-16 |
NOR Flash Serial-SPI 3V/3.3V 128Mbit 128M x 1Bit 8ns 16Pin SOIC W T/R
|
||
S25FL128P0XMFI013
|
Cypress Semiconductor | 类似代替 | SOIC-16 |
NOR Flash Serial-SPI 3V/3.3V 128Mbit 128M x 1Bit 8ns 16Pin SOIC W T/R
|
||
S25FL128P0XMFI013
|
Spansion | 类似代替 | SO-16 |
NOR Flash Serial-SPI 3V/3.3V 128Mbit 128M x 1Bit 8ns 16Pin SOIC W T/R
|
||
W25Q128FVFIG
|
Winbond Electronics | 类似代替 | SOIC-16 |
128-Mbit(16M x 8bit),SPI接口,工作电压:2.7V to 3.6V
|
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