Technical parameters/power supply current: 26 mA
Technical parameters/access time (Max): 8 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064LABBHI030
|
Cypress Semiconductor | 完全替代 | BGA-24 |
闪存, 浮动门架构, 串行NOR, 64 Mbit, 8M x 8位, SPI, BGA, 24 引脚
|
||
S25FL064P0XBHI020
|
Spansion | 完全替代 | BGA |
NOR Flash Serial-SPI 3V/3.3V 64M-bit 64M x 1 8ns 24Pin BGA Tray
|
||
S25FL064P0XBHI023
|
Spansion | 完全替代 | VBGA |
NOR闪存 Nor
|
||
S25FL064P0XBHI030
|
Cypress Semiconductor | 类似代替 | BGA-24 |
NOR Flash Serial-SPI 3V/3.3V 64Mbit 64M x 1Bit 8ns 24Pin BGA Tray
|
||
S25FL064P0XBHI030
|
Spansion | 类似代替 | BGA |
NOR Flash Serial-SPI 3V/3.3V 64Mbit 64M x 1Bit 8ns 24Pin BGA Tray
|
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