Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Surface Mount
Packaging parameters/pin spacing: 9.55 mm
External dimensions/length: 12.3 mm
External dimensions/width: 1.80 mm
External dimensions/height: 1.8 mm
External dimensions/pin spacing: 9.55 mm
Physical parameters/color: Silver
Physical parameters/contact material: Brass
Physical parameters/materials: Copper Alloy
Physical parameters/operating temperature: -40℃ ~ 105℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
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