Chip AI consultant
Encapsulation parameters/Encapsulation: Axial
External dimensions/packaging: Axial
Other/Technology: Wirewound
Other/Resistance Values: 33
Other/Power Rating: 2
Other/Tolerance: 1%
Other/Temperature Coefficient: ±20
Other/Failure Rates: S
Other/Packaging: Bulk
Other/Determination Style: Axial
Other/Counting: Through Hole
Other/Product Length: 10.31
Other/Product Weight: 0.34
Other/Military Standards: MIL-PRF-39007
Other/Maximum Operating Temperature: 250
Other/Minimum Operating Temperature: -55
Other/Product Diameter: 2.39
Other/Case Style: Silicone
Other/Life Cycles: Active
Other/Lead Diameter: 0.51
Other/Lead Length: 38.1
Other/Package Shape: Cylindrical
Other/Number of Terminals: 2
Other/Determination Forming: Not Formed
Other/Temperature Range @ Derated Power: 25 to 250
Other/Flame Proof Support: No
Other/Tail Safe Fusible Resistors: No
Other/Temperature Grade: Military
Other/Length Tolerance: ±0.79
Other/Diameter Tolerance: ±0.79
Other/Automotive: No
Other/AEC Qualified Number: N/R
Other/Base Material: Cu Clad Steel
Other/ECC Qualified: No
Other/Containers SVHC: NO
Other/DW Flag: N
Other/Exceed Limit: NO
Other/Lead Finish Material: SnPb
Other/Maximum Reflow Temperature: 260
Other/Maximum Wave Temperature: N/A
Other/Noise Sensitivity levels: 1
Other/Pin Out: N
Other/Schedule B: 8533210080
Other/Under Plating Materials: N/R
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review