Technical Parameters/Drivers/Packages: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65HVD10QD
|
TI | 完全替代 | SOIC-8 |
3.3V,RS-485差分收发器
|
||
SN65HVD10QDR
|
TI | 完全替代 | SOIC-8 |
3.3 V RS - 485收发器 3.3-V RS-485 TRANSCEIVERS
|
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