Technical parameters/rated power: 0.75 W
Technical parameters/resistance: 1000 Ω
Technical parameters/resistance deviation: ±1 %
Technical parameters/operating temperature (Max): 155 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation (metric): 5025
Encapsulation parameters/Encapsulation: 2010
External dimensions/length: 5 mm
External dimensions/width: 2.5 mm
External dimensions/height: 0.6 mm
Dimensions/Packaging (Metric): 5025
External dimensions/packaging: 2010
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CRCW20101K00FKEF
|
Vishay Semiconductor | 功能相似 | 2010 |
2010 格式 CRCW 系列 - 1% (Paper T/R)(10Ω 至 100kΩ) 高品质陶瓷金属上釉 保护盖上釉 极好的稳定性(70 °C 时,ΔR/R ≤ 1 % 1000 小时) 镍挡板层无铅焊接触点 纯锡镀层与无铅和含铅焊接工艺兼容 Power at 70°C | 0.5W ---|--- Resistance Tolerance | 1% Temperature Coefficient | 100 ppm/°C Operating Temperature | -55 → 155 °C Max.Operating Voltage | 200 V Dimensions (LxWxT) | 5 x 2.5 x 0.6mm
|
||
|
|
Vishay Draloric | 功能相似 | 2010 |
2010 格式 CRCW 系列 - 1% (Paper T/R)(10Ω 至 100kΩ) 高品质陶瓷金属上釉 保护盖上釉 极好的稳定性(70 °C 时,ΔR/R ≤ 1 % 1000 小时) 镍挡板层无铅焊接触点 纯锡镀层与无铅和含铅焊接工艺兼容 Power at 70°C | 0.5W ---|--- Resistance Tolerance | 1% Temperature Coefficient | 100 ppm/°C Operating Temperature | -55 → 155 °C Max.Operating Voltage | 200 V Dimensions (LxWxT) | 5 x 2.5 x 0.6mm
|
||
CRCW20101K00FKEF
|
VISHAY | 功能相似 | 2010 |
2010 格式 CRCW 系列 - 1% (Paper T/R)(10Ω 至 100kΩ) 高品质陶瓷金属上釉 保护盖上釉 极好的稳定性(70 °C 时,ΔR/R ≤ 1 % 1000 小时) 镍挡板层无铅焊接触点 纯锡镀层与无铅和含铅焊接工艺兼容 Power at 70°C | 0.5W ---|--- Resistance Tolerance | 1% Temperature Coefficient | 100 ppm/°C Operating Temperature | -55 → 155 °C Max.Operating Voltage | 200 V Dimensions (LxWxT) | 5 x 2.5 x 0.6mm
|
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CRCW20101K00FKTF
|
VISHAY | 功能相似 | 2010 |
2010 1kΩ ±1% 3/4W ±100ppm/℃
|
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