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Description RX630 The next generation microcontrollers in the RX 16 and 32-bit MCU series are based on the innovative RX CPU core, which enables new levels of MCUs to integrate the best features of RISC and CISC MCU architectures while adding DSP and floating-point mathematical capabilities. It perfectly combines innovative RX core wires with the industry's fastest embedded flash memory, enabling the RX600 series microcontroller to deliver industry-leading 1.65 dmips/MHz and including support for digital signal processing and floating-point operations. ###RX series microcontroller, Renesas Electronics
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Packaging TFLGA-177
Delivery time
Packaging method Tray
Standard packaging quantity 1
55.82  yuan 55.82yuan
1+:
$ 64.1942
10+:
$ 61.4031
100+:
$ 60.9007
250+:
$ 60.5100
500+:
$ 59.8959
1000+:
$ 59.6168
2500+:
$ 59.2261
5000+:
$ 58.8912
Quantity
1+
10+
100+
250+
500+
Price
$64.1942
$61.4031
$60.9007
$60.5100
$59.8959
Price $ 64.1942 $ 61.4031 $ 60.9007 $ 60.5100 $ 59.8959
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9788) Minimum order quantity(1)
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Technical parameters/power supply voltage (DC): 2.70V (min)

Technical parameters/working voltage: 2.7V ~ 3.6V

Technical parameters/RAM size: 128 KB

Technical parameters/Analog to Digital Conversion (ADC): 2

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 177

Encapsulation parameters/Encapsulation: TFLGA-177

External dimensions/length: 8 mm

External dimensions/width: 8 mm

External dimensions/height: 1.05 mm

External dimensions/packaging: TFLGA-177

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

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