Technical parameters/clock frequency: 20.0 MHz
Technical parameters/RAM size: 2.5K x 8
Technical parameters/dissipated power: 300 mW
Technical parameters/access time: 20.0 µs
Technical parameters/kernel architecture: R8C
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 300 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: LQFP-48
External dimensions/packaging: LQFP-48
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
R5F21206JFP
|
Renesas Electronics | 功能相似 | LFQFP |
R8C / 20群, R8C / 21组瑞萨MCU R8C/20 Group, R8C/21 Group RENESAS MCU
|
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