Encapsulation parameters/Encapsulation: 25.27 mm x 15.75 mm x 9 mm
External dimensions/packaging: 25.27 mm x 15.75 mm x 9 mm
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PTH05060YAS
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TI | 完全替代 | DIP-10 |
存储器总线终端模块 MEMORY BUS TERMINATION MODULES
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Artesyn Embedded Technologies | 完全替代 |
Module DC-DC 5Vin 1Out 0.55V to 1.8V 10A 10Pin DIP Module T/R
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TI | 类似代替 | DIP-10 |
Module DC-DC 5Vin 1Out 0.55V to 1.8V 10A 18W 10Pin SMD Module Tray
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Artesyn Embedded Technologies | 类似代替 | SMD-10 |
Module DC-DC 5Vin 1Out 0.55V to 1.8V 10A 18W 10Pin SMD Module Tray
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