Technical parameters/RAM size: 226304 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Technical parameters/power supply voltage (Max): 1.26 V
Technical parameters/power supply voltage (Min): 1.14 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 132
Encapsulation parameters/Encapsulation: CSBGA-132
External dimensions/length: 8 mm
External dimensions/width: 8 mm
External dimensions/height: 1.1 mm
External dimensions/packaging: CSBGA-132
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFXP2-8E-6MN132C
|
Lattice Semiconductor | 完全替代 | CSBGA-132 |
FPGA - 现场可编程门阵列 8K LUTs 86I/O Inst- on DSP 1.2V -6 Spd
|
||
LFXP2-8E-7MN132C
|
Lattice Semiconductor | 完全替代 | CSBGA-132 |
FPGA - 现场可编程门阵列 8K LUTs 86I/O Inst- on DSP 1.2V -7 Spd
|
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