Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 900
Encapsulation parameters/Encapsulation: FPBGA-900
External dimensions/length: 31 mm
External dimensions/width: 31 mm
External dimensions/height: 1.65 mm
External dimensions/packaging: FPBGA-900
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFE2M70SE-7FN900C
|
Lattice Semiconductor | 完全替代 | FPBGA-900 |
FPGA - 现场可编程门阵列 67K LUTs 416 S Ser Memory DSP 1.2V 7SPD
|
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