Technical parameters/RAM size: 3.8K x 8
Technical parameters/digits: 8
Technical parameters/dissipated power: 1000 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/length: 17.9 mm
External dimensions/width: 7.5 mm
External dimensions/height: 2.05 mm
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC18LF26K22-I/SO
|
Micrel | 类似代替 |
MICROCHIP PIC18LF26K22-I/SO 微控制器, 8位, 闪存, PIC18LFxxKxx, 64 MHz, 64 KB, 3.8 KB, 28 引脚, SOIC
|
|||
PIC18LF26K22-I/SO
|
Microchip | 类似代替 | SOIC-28 |
MICROCHIP PIC18LF26K22-I/SO 微控制器, 8位, 闪存, PIC18LFxxKxx, 64 MHz, 64 KB, 3.8 KB, 28 引脚, SOIC
|
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