Technical parameters/RAM size: 1K x 8
Technical parameters/dissipated power: 800 mW
Technical parameters/dissipated power (Max): 800 mW
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC16F18855-I/SO
|
Microchip | 类似代替 | SOIC-28 |
MICROCHIP PIC16F18855-I/SO 微控制器, 8位, 极低功率(XLP), PIC16F, 32 MHz, 14 KB, 1 KB, 28 引脚, SOIC
|
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