Technical parameters/power supply voltage (DC): 5.00 V, 5.50 V (max)
Technical parameters/clock frequency: 20.0MHz (max)
Technical parameters/RAM size: 24 x 8
Technical parameters/dissipated power: 800 mW
Technical parameters/I/O pin count: 20
Technical parameters/access time: 20.0 µs
Technical parameters/kernel architecture: PIC
Technical parameters/internal nuclear architecture: PIC16
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC16C55-HS/SO
|
Micrel | 类似代替 |
PIC16 系列 24 B RAM 512 x 12位 EPROM 8位 CMOS 微控制器 - SOIC-28
|
|||
PIC16C55-HS/SO
|
Microchip | 类似代替 | SOIC-28 |
PIC16 系列 24 B RAM 512 x 12位 EPROM 8位 CMOS 微控制器 - SOIC-28
|
||
PIC16C55T-HS/SO
|
Microchip | 类似代替 | SOIC-28 |
8位微控制器 -MCU .75KB 24 RAM 20 I/O HSC SOIC-28
|
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