Technical parameters/RAM size: 64 x 8
Technical parameters/digits: 8
Technical parameters/dissipated power: 800 mW
Technical parameters/dissipated power (Max): 800 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PIC12F752-E/MF
|
Microchip | 完全替代 | DFN-8 |
PIC 20MHz 闪存:1K@x14bit
|
||
PIC12F752-E/SN
|
Microchip | 完全替代 | SOIC-8 |
8位微控制器 -MCU 1.75KB 64BRAM 6 I/O 8MHz Int Osc 5MIPS
|
||
PIC12F752T-I/MF
|
Microchip | 完全替代 | DFN-8 |
PIC12F 系列 1.75 KB 闪存 64 B RAM 20 MHz 8位 微控制器 - DFN-8
|
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