Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LFQFP
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/packaging: LFQFP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Intel | 功能相似 | QFP |
网络控制器与处理器 IC T/E
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