Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TP3054N-X/NOPB
|
TI | 功能相似 | DIP-16 |
IC ENHANCED INTERFACE SER 16-DIP
|
||
TP3054N-X/NOPB
|
National Semiconductor | 功能相似 | DIP-16 |
IC ENHANCED INTERFACE SER 16-DIP
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review