Technical parameters/dissipated power: 640000 mW
Technical parameters/breakdown voltage (collector emitter): 1200 V
Technical parameters/Input capacitance (Cies): 6.5nF @25V
Technical parameters/rated power (Max): 640 W
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 640000 mW
Encapsulation parameters/installation method: Chassis
Package parameters/number of pins: 19
Encapsulation parameters/Encapsulation: E3
External dimensions/height: 17 mm
External dimensions/packaging: E3
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BSM100GD120DN2
|
Siemens Semiconductor | 功能相似 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes)
|
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