Technical parameters/RAM size: 64 KB
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: FBGA-672
External dimensions/packaging: FBGA-672
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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