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Model MT44K32M18RB-107:A
Description DRAM Chip RLDRAM3 576Mbit 32Mx18 1.35V 168Pin FBGA
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Brand: Micron
Packaging TBGA-168
Delivery time
Packaging method Bulk
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8010) Minimum order quantity(1)
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Technical parameters/working voltage: 1.35 V

Technical parameters/power supply voltage: 1.28V ~ 1.42V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 168

Encapsulation parameters/Encapsulation: TBGA-168

External dimensions/packaging: TBGA-168

Physical parameters/operating temperature: 0℃ ~ 95℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Bulk

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
MT44K32M18RB-107E:A MT44K32M18RB-107E:A Micron 类似代替 BGA-168
DRAM Chip RLDRAM3 576Mbit 32Mx18 1.35V 168Pin FBGA
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