Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSOP1
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micron | 功能相似 | TSOP1 |
NAND Flash Parallel 3.3V 64M-bit 8M x 8/4M x 16 115ns 56Pin TSOP-I Tray
|
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