Technical parameters/dissipated power: 290000 mW
Technical parameters/operating temperature (Max): 200 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 290000 mW
Encapsulation parameters/installation method: Screw
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: M-174
External dimensions/packaging: M-174
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2SC2879
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Toshiba | 功能相似 |
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SD1487
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Advanced Semiconductor | 功能相似 |
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SD1487
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ST Microelectronics | 功能相似 | M174 |
射频与微波晶体管短波单边带应用 RF & MICROWAVE TRANSISTORS HF SSB APPLICATIONS
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