Encapsulation parameters/Encapsulation: BBGA-783
External dimensions/packaging: BBGA-783
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Motorola | 功能相似 | 783 |
NXP MPC8541ECVTAJD Microprocessor, PowerQUICC III Series, 533MHz, 32Bit, 64KB, 1.14V to 1.26V, BGA-783
|
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MPC8541ECVTAJD
|
Freescale | 功能相似 | FCPBGA-783 |
NXP MPC8541ECVTAJD Microprocessor, PowerQUICC III Series, 533MHz, 32Bit, 64KB, 1.14V to 1.26V, BGA-783
|
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