Encapsulation parameters/Encapsulation: BBGA-783
External dimensions/packaging: BBGA-783
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC8536CVTAQGA
|
NXP | 完全替代 | FCBGA-783 |
MPU PowerQUICC III MPC85xx Processor RISC 32Bit 0.09um 1GHz 1.5V/1.8V/2.5V/3.3V 783Pin FCBGA Tray
|
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