Technical parameters/power supply voltage (DC): 2.00 V, 2.10 V (max)
Technical parameters/halogen-free state: Halogen Free
Technical parameters/clock frequency: 300 MHz
Technical parameters/digits: 64
Technical parameters/access time: 300 µs
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 360
Encapsulation parameters/Encapsulation: FCPBGA-360
External dimensions/packaging: FCPBGA-360
Physical parameters/operating temperature: 0℃ ~ 105℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC755BPX300LE
|
NXP | 类似代替 | FCBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 300MHz 2.5V/3.3V 360Pin FCBGA Tray
|
||
MPC755BPX300LE
|
Freescale | 类似代替 | FCPBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 300MHz 2.5V/3.3V 360Pin FCBGA Tray
|
||
MPC755BRX300LE
|
Freescale | 完全替代 | CBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 300MHz 2.5V/3.3V 360Pin FCCBGA Tray
|
||
MPC755BRX300LE
|
NXP | 完全替代 | BCBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 300MHz 2.5V/3.3V 360Pin FCCBGA Tray
|
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