Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BCBGA-360
External dimensions/packaging: BCBGA-360
Physical parameters/operating temperature: 0℃ ~ 105℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
6A2-T
|
Diodes | 功能相似 | R-6 |
RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
||
6A2-T
|
IBM | 功能相似 | BGA |
RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
||
6A2-T
|
Sensitron Semiconductor | 功能相似 |
RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
|
|||
MPC755BPX350LE
|
NXP | 功能相似 | FCBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 350MHz 2.5V/3.3V 360Pin FCBGA Tray
|
||
MPC755BPX350LE
|
Freescale | 功能相似 | BBGA-360 |
MPU PowerPC MPC7xx Processor RISC 64Bit 0.22um 350MHz 2.5V/3.3V 360Pin FCBGA Tray
|
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