Technical parameters/halogen-free state: Not Halogen Free
Technical parameters/RAM size: 32K x 8
Technical parameters/power supply voltage (Max): 2.7V, 5.25V
Technical parameters/power supply voltage (Min): 2.5V, 4.75V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 388
Encapsulation parameters/Encapsulation: BGA-388
External dimensions/packaging: BGA-388
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC563MZP56
|
NXP | 完全替代 | PBGA-388 |
MCU 32Bit e200 RISC 512KB Flash 2.6V/5V Automotive 388Pin BGA Tray
|
||
MPC564CZP40
|
NXP | 类似代替 | PBGA-388 |
MCU 32Bit MPC56xx e200 RISC 512KB Flash 2.6V/5V 388Pin BGA Tray
|
||
MPC564CZP40
|
Freescale | 类似代替 | BGA-388 |
MCU 32Bit MPC56xx e200 RISC 512KB Flash 2.6V/5V 388Pin BGA Tray
|
||
MPC564MZP56
|
NXP | 类似代替 | BGA-388 |
32位微控制器 - MCU MPC564 512KFLASH Qorivva
|
||
MPC564MZP56
|
Freescale | 类似代替 | BGA-388 |
32位微控制器 - MCU MPC564 512KFLASH Qorivva
|
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