Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMP7300MA
|
TI | 功能相似 | SOIC |
TEXAS INSTRUMENTS LMP7300MA 模拟比较器, 轨至轨, 精度, 1, 4 ms, 2.7V 至 12V, SOIC, 8 引脚
|
||
LMP7300MAX/NOPB
|
National Semiconductor | 完全替代 | SOIC-8 |
具有可调节滞后现象的微功耗精密比较器和精密基准 8-SOIC -40 to 125
|
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